SM662GBD-BFSS

Memory IC Overview

The SM662GBD-BFSS is a NAND flash memory integrated circuit manufactured by Silicon Motion, Inc. It utilizes Single-Level Cell (SLC) technology and supports the eMMC 5.1 interface standard. The device offers a total memory capacity of 320 Gbit, which corresponds to 40 GB of usable storage. It is housed in a 100-ball Ball Grid Array (BGA) package with dimensions of 14x18 mm, designed for surface-mount technology applications.

Memory IC Feature Summary

• Supports eMMC 5.1 interface protocol for high-speed data transfer
• Utilizes SLC NAND flash technology for reliable data retention
• Integrated controller within a compact BGA-100 package

Memory IC Applications

• Embedded multimedia cards in consumer electronics
• Industrial control systems requiring robust storage
• Automotive infotainment and telematics units

Memory IC Procurement Notes

Verify the specific suffix BFSS against official Silicon Motion documentation to confirm pinout and thermal specifications. Ensure compatibility with host controllers supporting eMMC 5.1 standards. Confirm package dimensions match the target PCB layout requirements before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when a high-reliability SLC solution is required for embedded environments. The 320 Gbit capacity provides substantial storage within a small footprint. Consider the BGA-100 package constraints during PCB design to ensure adequate soldering and thermal management capabilities are available.

Memory IC Part Context

This part belongs to the Ferri-eMMC series from Silicon Motion, Inc., which integrates NAND flash and controller functions into a single package. The series targets applications demanding high performance and durability in space-constrained designs, leveraging advanced manufacturing processes for improved efficiency.

Memory IC Replacement Considerations

Direct replacements must match the 100-BGA form factor and eMMC 5.1 interface. Verify that alternative parts support SLC technology if endurance is critical. Cross-reference pin assignments and electrical characteristics with official datasheets to ensure functional equivalence.