SM662GXE BFST

Memory IC Overview

The SM662GXE BFST is a Ferri-eMMC™ NAND flash memory IC manufactured by Silicon Motion, Inc. It features a 2Tbit (256G x 8) storage capacity and utilizes TLC technology. The component interfaces via eMMC 5.1 protocol and is housed in a 100-ball BGA package measuring 14x18 mm. It is designed for embedded storage applications requiring high density and reliability.

Memory IC Feature Summary

• Ferri-eMMC architecture combining NAND flash with controller logic
• Supports both SLC and TLC NAND technologies
• High-density 2Tbit storage configuration
• eMMC 5.1 interface compliance

Memory IC Applications

• Mobile devices
• Industrial automation systems
• Automotive infotainment
• IoT devices

Memory IC Procurement Notes

Verify the exact suffix (BFST) against official Silicon Motion documentation to confirm pinout and electrical specifications. Ensure compatibility with host controllers supporting eMMC 5.1 standards. Cross-reference package dimensions (14x18mm) with PCB layout requirements before integration.

Memory IC Selection Notes

Select this component for applications requiring high-capacity embedded storage within a compact footprint. Consider the 100-BGA package constraints during design. Verify thermal management needs for TLC operation in industrial or automotive environments.

Memory IC Part Context

Part of the Ferri-eMMC series from Silicon Motion, integrating controller and memory. This model represents a high-density solution targeting mobile and industrial sectors. The SM662 series emphasizes performance and form factor efficiency for modern embedded systems.

Memory IC Replacement Considerations

Check for direct substitutes within the SM662 family with compatible suffixes. Verify pin-to-pin compatibility and firmware support when considering alternative NAND densities or interface versions.