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SM662GXF BFSS is listed in the Memory IC range at ChipApex. The manufacturer field lists Silicon Motion, Inc.. Its product description is IC FLASH 960GBIT EMMC 100BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for SM662GXF BFSS
- Description：IC FLASH 960GBIT EMMC 100BGA
- Series：Ferri-eMMC®
- Mfr：Silicon Motion, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (SLC)
- Memory Size：960Gbit
- Memory Organization：160G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-25°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：100-LBGA
- Supplier Device Package：100-BGA (14x18)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for SM662GXF BFSS
Memory IC Overview
The SM662GXF BFSS is a NAND flash memory integrated circuit manufactured by Silicon Motion, Inc. It utilizes Single-Level Cell (SLC) technology and supports the eMMC interface standard. The device offers a storage capacity of 160 Gbit (20 GB). It is housed in a 100-LBGA package with dimensions of 14x18 mm. This component is designed for solid-state storage applications requiring reliable non-volatile data retention.
Memory IC Feature Summary
- Integrates SLC NAND flash memory with an embedded controller
- Supports eMMC interface protocol for standardized connectivity
- Provides 160 Gbit storage capacity in a compact BGA form factor
Memory IC Applications
- Solid State Drive (SSD) modules
- Embedded multimedia card systems
- Consumer electronics storage solutions
Memory IC Procurement Notes
Verify the specific suffix BFSS against official Silicon Motion documentation to confirm pinout and electrical characteristics. Ensure compatibility with host controllers supporting eMMC standards. Confirm RoHS compliance status through manufacturer datasheets before integration into regulated environments.
Memory IC Selection Notes
Select this component when SLC endurance and reliability are prioritized over high-density TLC/QLC capacities. The 100-BGA package requires appropriate PCB layout considerations for thermal management and signal integrity. Verify that the host system supports the required eMMC version and voltage levels specified in the technical manual.
Memory IC Part Context
Silicon Motion, Inc. specializes in NAND flash controllers for SSDs and solid-state storage devices. The SM662 series represents their embedded memory solutions, targeting markets requiring robust data storage within compact footprints. This part belongs to their portfolio of merchant-grade storage components.
Memory IC Replacement Considerations
Cross-reference with other SM662 variants such as SM662PE4-ACH or SM662PAC-BESS for package and interface compatibility. Verify if alternative suffixes offer different temperature ranges or packaging options while maintaining functional equivalence.
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