SM662PAE-BDST

Description：IC FLASH 2TBIT EMMC 100BGA
Series：Ferri-eMMC®
Mfr：Silicon Motion, Inc.
Package：Tray

SKU:0196c341481b Category: Memory IC Brand: Silicon Motion, Inc.

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Product introduction

SM662PAE-BDST is listed in the Memory IC range at ChipApex. The manufacturer field lists Silicon Motion, Inc.. Its product description is IC FLASH 2TBIT EMMC 100BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for SM662PAE-BDST

Description：IC FLASH 2TBIT EMMC 100BGA
Series：Ferri-eMMC®
Mfr：Silicon Motion, Inc.
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND (TLC)
Memory Size：2Tbit
Memory Organization：256G x 8
Memory Interface：eMMC
Clock Frequency：-
Write Cycle Time - Word, Page：-
Voltage - Supply：-
Operating Temperature：-40°C ~ 85°C
Mounting Type：Surface Mount
Package / Case：100-LBGA
Supplier Device Package：100-BGA (14x18)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for SM662PAE-BDST

SM662PAE-BDST

Memory IC Overview

The SM662PAE-BDST is a NAND flash memory component manufactured by Silicon Motion, Inc. It utilizes Single-Level Cell (SLC) NAND technology and operates as an embedded MultiMediaCard (eMMC). The device features a 100-LBGA package. Specific capacity and speed parameters for this exact suffix are not verified in the provided source material.

Memory IC Feature Summary

Utilizes SLC NAND flash technology for data storage
Operates as an eMMC interface device
Packaged in a 100-LBGA format

Memory IC Applications

Embedded storage systems requiring eMMC compatibility

Memory IC Procurement Notes

Verify the specific capacity and speed grade for the BDST suffix against official Silicon Motion documentation. Confirm the 100-LBGA package dimensions and pinout details prior to integration. Ensure the component meets all required environmental and operational specifications for the target application.

Memory IC Selection Notes

Select this component if the design requires an eMMC interface with SLC NAND reliability. Verify that the 100-LBGA package fits the board layout constraints. Compare performance metrics with other SM662 series variants to ensure the BDST suffix meets specific throughput or endurance requirements.

Memory IC Part Context

This part belongs to the SM662 series of embedded multimedia cards from Silicon Motion. Similar models include the SM662PAE-BESS and SM662PAC-BESS, which share the same manufacturer and general eMMC architecture but may differ in capacity or speed grades.

Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.

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