Memory IC SM662PXC-BFSS product image

SM662PXC-BFSS

$14.03
  • Description:IC FLASH 160GBIT EMMC 153BGA
  • Series:Ferri-eMMC®
  • Mfr:Silicon Motion, Inc.
  • Package:Bulk

SKU:5d08a4fb6282 Category: Brand:

  
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SM662PXC-BFSS is listed in the Memory IC range at ChipApex. The manufacturer field lists Silicon Motion, Inc.. Its product description is IC FLASH 160GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for SM662PXC-BFSS

  • Description:IC FLASH 160GBIT EMMC 153BGA
  • Series:Ferri-eMMC®
  • Mfr:Silicon Motion, Inc.
  • Package:Bulk
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (SLC)
  • Memory Size:160Gbit
  • Memory Organization:20G x 8
  • Memory Interface:eMMC
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-25°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:153-TBGA
  • Supplier Device Package:153-BGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for SM662PXC-BFSS

SM662PXC-BFSS

Memory IC Overview

The SM662PXC-BFSS is a NAND flash memory controller from Silicon Motion, Inc., packaged in a 153-ball TFBGA (11.5x13 mm). It supports eMMC 5.0 interface standards and utilizes SLC NAND technology with a total capacity of 160 Gbit (20G x 8). The component is designed for high-density non-volatile storage applications.

Memory IC Feature Summary

  • Supports eMMC 5.0 interface protocol
  • Utilizes SLC NAND flash technology
  • Integrated controller for embedded storage

Memory IC Applications

  • Embedded computing systems
  • High-density non-volatile storage modules
  • Next-generation computing applications

Memory IC Procurement Notes

Verify the specific suffix BFSS against official Silicon Motion documentation to confirm pinout and electrical characteristics. Ensure compatibility with target PCB layout constraints for the 153-ball TFBGA package. Cross-reference the 160 Gbit capacity requirement with system design specifications before procurement.

Memory IC Selection Notes

Select this component when an eMMC 5.0 interface with SLC reliability is required. The 153-ball TFBGA package suits space-constrained designs. Confirm that the 160 Gbit density meets application needs compared to other series members like the 512 Gbit TLC variants.

Memory IC Part Context

Part of the Ferri-eMMC series by Silicon Motion. Designed for embedded environments requiring robust non-volatile storage solutions.

Memory IC Replacement Considerations

Check for direct substitutes within the SM662 family or compatible eMMC controllers. Verify package and interface compatibility before substitution.

SM662PXC-BFSSSM662PXC-BFSS
$14.03
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