Memory IC SM662PXE BESS product image

SM662PXE BESS

  • Description:IC FLASH 640GBIT EMMC 100BGA
  • Series:Ferri-eMMC®
  • Mfr:Silicon Motion, Inc.
  • Package:Tray

SKU:a25914845a5a Category: Brand:

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SM662PXE BESS is listed in the Memory IC range at ChipApex. The manufacturer field lists Silicon Motion, Inc.. Its product description is IC FLASH 640GBIT EMMC 100BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for SM662PXE BESS

  • Description:IC FLASH 640GBIT EMMC 100BGA
  • Series:Ferri-eMMC®
  • Mfr:Silicon Motion, Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (SLC)
  • Memory Size:640Gbit
  • Memory Organization:80G x 8
  • Memory Interface:eMMC
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-25°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-BGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for SM662PXE BESS

SM662PXE BESS

Memory IC Overview

The SM662PXE BESS is a NAND flash memory component manufactured by Silicon Motion, Inc. It belongs to the Ferri-eMMC series and utilizes Single-Level Cell (SLC) technology. The device offers a storage capacity of 640 Gb and features an eMMC interface with an x8 data bus width. It is housed in a 100-LBGA package.

Memory IC Feature Summary

  • Integrates SLC NAND flash for non-volatile data retention
  • Supports eMMC communication protocol
  • Includes embedded controller functionality

Memory IC Applications

  • Embedded multimedia card systems
  • Solid-state storage solutions
  • Consumer electronic devices requiring reliable data storage

Memory IC Procurement Notes

Verify the specific suffix BESS against official Silicon Motion documentation to confirm exact configuration details. Ensure compatibility with host controllers supporting the eMMC standard. Confirm package dimensions match the 100-LBGA specification before integration into design layouts.

Memory IC Selection Notes

Select this component when SLC NAND reliability is required over higher-density MLC or TLC options. The eMMC interface simplifies system integration compared to raw NAND. Consider the 100-LBGA package constraints for PCB layout and thermal management during the selection process.

Memory IC Part Context

This part is part of the Ferri-eMMC family from Silicon Motion, which combines NAND flash with a dedicated controller. This integration provides a standardized interface for embedded applications, reducing development complexity for system designers compared to discrete NAND solutions.

SM662PXE BESSSM662PXE BESS

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