Memory IC SM671PXE-ADST product image

SM671PXE-ADST

  • Description:IC FLASH 2TBIT UFS3.1 153BGA
  • Series:Ferri-UFS ™
  • Mfr:Silicon Motion, Inc.
  • Package:Tray

SKU:4f1a5e4ea814 Category: Brand:

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SM671PXE-ADST is listed in the Memory IC range at ChipApex. The manufacturer field lists Silicon Motion, Inc.. Its product description is IC FLASH 2TBIT UFS3.1 153BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for SM671PXE-ADST

  • Description:IC FLASH 2TBIT UFS3.1 153BGA
  • Series:Ferri-UFS ™
  • Mfr:Silicon Motion, Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (TLC)
  • Memory Size:2Tbit
  • Memory Organization:256G x 8
  • Memory Interface:UFS3.1
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-25°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:153-TFBGA
  • Supplier Device Package:153-BGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for SM671PXE-ADST

SM671PXE-ADST

Memory IC Overview

The SM671PXE-ADST is a non-volatile NAND flash memory component manufactured by Silicon Motion, Inc. It utilizes TLC NAND technology and supports the UFS 2.1 interface standard. The device offers a total storage capacity of 2 terabits and is housed in a 153-ball BGA package. This integrated solution combines flash memory with controller logic for solid-state storage applications.

Memory IC Feature Summary

  • Integrates NAND flash memory with controller functionality
  • Supports UFS 2.1 interface protocol
  • Utilizes Triple-Level Cell (TLC) NAND technology

Memory IC Applications

  • Solid-state storage devices
  • Mobile computing platforms
  • Embedded systems requiring high-density storage

Memory IC Procurement Notes

Verify the exact suffix against official Silicon Motion documentation to confirm pinout and electrical specifications. Ensure compatibility with host controllers supporting UFS 2.1 standards. Confirm RoHS compliance status through the manufacturer's current datasheet before integration into final designs.

Memory IC Selection Notes

Select this component for applications requiring high-density storage within a compact form factor. The 153-ball BGA package suits space-constrained designs. Verify that the system architecture supports the UFS 2.1 protocol and that power requirements align with the device specifications found in the official datasheet.

Memory IC Part Context

Silicon Motion specializes in NAND flash controllers for SSDs and eMMCs. The SM671 series represents their Ferri-UFS line, integrating controller and memory for simplified design. This part belongs to a family of high-performance storage solutions aimed at mobile and embedded markets.

Memory IC Replacement Considerations

Check for updated revisions from Silicon Motion. Cross-reference with other UFS 2.1 devices from the same manufacturer ensuring identical package dimensions and pin assignments.

SM671PXE-ADSTSM671PXE-ADST

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