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SM671PXF-BFST is listed in the Memory IC range at ChipApex. The manufacturer field lists Silicon Motion, Inc.. Its product description is IC FLASH 4TBIT UFS3.1 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for SM671PXF-BFST
- Description：IC FLASH 4TBIT UFS3.1 153BGA
- Series：Ferri-UFS ™
- Mfr：Silicon Motion, Inc.
- Package：Bulk
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (TLC)
- Memory Size：4Tbit
- Memory Organization：512G x 8
- Memory Interface：UFS3.1
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-25°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-TBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for SM671PXF-BFST
Memory IC Overview
The SM671PXF-BFST is a NAND FLASH memory device from Silicon Motion, Inc., utilizing advanced 3D TLC architecture for high data density. It features a UFS 3.1 interface and offers a memory size of 4Tbit with an organization of 512G x 8. The component is housed in a 153-BGA package measuring 11.5x13 mm. It supports surface mount technology and operates within a temperature range of -25°C to 85°C.
Memory IC Feature Summary
- Utilizes advanced 3D Triple-Level Cell (TLC) NAND architecture for enhanced data density and cost efficiency.
- Integrates the Universal Flash Storage (UFS) 3.1 interface standard for high-speed data transfer capabilities.
Memory IC Applications
- Mobile devices requiring high-capacity storage
- Embedded systems utilizing UFS interfaces
- Consumer electronics needing compact non-volatile memory solutions
Memory IC Procurement Notes
Verify the specific suffix BFST against official Silicon Motion documentation to confirm pinout and thermal specifications. Ensure compatibility with UFS 3.1 host controllers. Confirm the 153-BGA footprint dimensions match your PCB design constraints before ordering.
Memory IC Selection Notes
Select this component when high storage density is required alongside the UFS 3.1 interface standard. Consider the 3D TLC architecture for balanced performance and capacity. Verify that the operating temperature range of -25°C to 85°C meets your environmental requirements.
Memory IC Part Context
Silicon Motion, Inc. is a leading provider of NAND flash controller chips. This part belongs to their Ferri-UFS series, designed for mobile and embedded applications. The company focuses on delivering high-performance storage solutions with integrated controllers.
Memory IC Replacement Considerations
Check for direct substitutes within the SM671PXF family with different suffixes. Ensure any replacement maintains the UFS 3.1 interface and 153-BGA package form factor. Consult official cross-reference lists for verified alternatives.
Memory IC FAQ
What type of NAND architecture does the SM671PXF-BFST use?
It uses advanced 3D Triple-Level Cell (TLC) NAND architecture.
What is the memory organization of this device?
The memory organization is 512G x 8.
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