SMD-21-09-1-C

Overview

The SMD-21-09-1-C is a surface-mount board-to-board connector system manufactured by TE Connectivity AMP Connectors. This specific component belongs to the SMD series, designed for high-density interconnect applications in compact electronic assemblies. The part number indicates a 21-position configuration with a 0.5mm pitch, suitable for reliable signal and power transmission in space-constrained environments.

Feature Summary

• Surface-mount technology design for automated assembly processes
• High-density interconnect capability with fine pitch spacing
• Robust mechanical locking mechanism for secure mating

Applications

• Mobile communication devices
• Portable consumer electronics
• Medical instrumentation modules

Procurement Notes

Verify exact pin count and pitch specifications against official datasheets before procurement. Confirm RoHS compliance status and packaging quantity requirements. Ensure compatibility with existing PCB footprint designs and reflow soldering profiles specified by the manufacturer.

Selection Notes

Select this component when high-density board-to-board connections are required in surface-mount assemblies. Consider the 0.5mm pitch for space-constrained designs requiring reliable signal integrity. Evaluate mechanical retention needs and mating cycle requirements against application specifications.

Part Context

This connector is part of TE Connectivity's broader SMD board-to-board portfolio, which offers various position counts and pitch options. The series is engineered for modern electronics manufacturing trends emphasizing miniaturization and automated production efficiency.

Replacement Considerations

Consult official cross-reference guides for verified substitute part numbers. Ensure any replacement maintains identical pitch, pin count, and mounting style specifications to guarantee mechanical and electrical compatibility within the existing assembly.