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SMT-0952-T-5V-2-R is listed in the Alarms, Buzzers, And Sirens range at ChipApex. The manufacturer field lists PUI Audio, Inc.. Its product description is AUDIO PIEZO TRANSDUCER 1-25V SMD. Review the specifications below when checking this part for your BOM.
The SMT-0952-T-5V-2-R is an electromagnetic transducer from PUI Audio, designed for surface-mount applications. It features a square footprint with gullwing lead termination. Key electrical parameters include an impedance of 18 Ohms and a self-resonant frequency of 5.2 kHz. The device delivers a sound pressure level of 70 dBA at 100mm distance. It operates within a temperature range of -40°C to +85°C and supports a maximum supply voltage of 30VAC.
Verify the specific suffix '2-R' against official PUI Audio documentation to confirm reel packaging specifications and tape-and-reel dimensions. Ensure compatibility with standard SMT pick-and-place equipment regarding component height and lead form. Cross-reference the datasheet revision date to validate current electrical tolerances and material compliance certificates before finalizing procurement orders.
Select this component when board space constraints necessitate a low-profile, surface-mount solution over through-hole alternatives. The 18 Ohm impedance requires matching driver circuitry to achieve optimal power transfer and sound pressure levels. Consider the 5.2 kHz resonant frequency for applications prioritizing high-pitched alert tones rather than low-frequency bass responses.
This part belongs to the SMT series of piezoelectric and electromagnetic transducers manufactured by PUI Audio. The series focuses on miniaturized audio components suitable for modern electronics where traditional bulky speakers are impractical. The SMT-0952 variant specifically targets cost-sensitive consumer markets requiring reliable, mass-producible acoustic signaling elements.
Direct substitutes must match the 10x10mm footprint, 18 Ohm impedance, and 5.2 kHz resonance. Verify that alternative manufacturers offer identical gullwing lead configurations to ensure seamless reflow soldering process integration without mechanical redesign.
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