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Product Detailed Parameters
- Description：IC GATE AND 4CH 2-INP DIE
- Series：54HC
- Mfr：Texas Instruments
- Package：Tube
- Logic Type：AND Gate
- Number of Circuits：4
- Number of Inputs：2
- Features：-
- Voltage - Supply：-
- Current - Quiescent (Max)：-
- Current - Output High, Low：-
- Input Logic Level - Low：-
- Input Logic Level - High：-
- Max Propagation Delay @ V, Max CL：-
- Operating Temperature：-
- Mounting Type：-
- Supplier Device Package：Die
- Package / Case：Die
- Grade：-
- Qualification：-
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Overview
The SN54HC08VTDF2 is a quadruple 2-input positive-AND gate die from Texas Instruments, belonging to the HC/UH series. It features a ceramic dual in-line package (CDIP) configuration with 14 terminals and operates within an extended temperature range of -55°C to 125°C. The device supports a supply voltage range of 2V to 6V, delivering output currents of 5.2mA at both high and low states. It exhibits a maximum propagation delay of 17ns at 6V with a 50pF load and maintains a maximum static current of 2µA.
Feature Summary
- Hermetically sealed ceramic construction designed for radiation-hardened aerospace environments
- Quadruple 2-input AND logic functionality integrated into a single die format
- Extended industrial temperature operation capability ranging from -55°C to 125°C
Applications
- Radiation-tolerant aerospace systems
- Military-grade digital logic circuits
- High-reliability space production baseline applications
Procurement Notes
Verify that the specific part number corresponds to the hermetically sealed ceramic die variant intended for space production baselines. Confirm compliance with Texas Instruments' radiation-hardened processing requirements. Ensure the application environment matches the specified -55°C to 125°C operating range. Check for any specific handling protocols required for bare die components versus packaged equivalents.
Selection Notes
Select this component when hermetic sealing and radiation hardness are mandatory for the design. It serves as the die equivalent to the SN54HC08J ceramic DIP package. Choose this over standard plastic packages if environmental protection against moisture and contaminants is critical. Ensure the system architecture can accommodate bare die mounting techniques rather than traditional socketed or through-hole implementations.
Part Context
This component is part of the SN54xx series, which denotes military-grade performance standards compared to the commercial SN74xx series. It shares logical functionality with the SN54HC08J but differs in packaging form factor. The 'VTDF2' suffix indicates the specific tape-and-reel die configuration processed according to Texas Instruments' space production baseline guidelines.
Replacement Considerations
The SN54HC08J is the direct packaged equivalent offering identical logical function and hermetic ceramic construction. Verify that the target application supports bare die integration if replacing the packaged version with this die. Ensure thermal management strategies align with the power dissipation characteristics of the HC series logic family.
