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Product Detailed Parameters
- Description：IC GATE NAND SCHMITT 4CH DIE
- Series：54HC
- Mfr：Texas Instruments
- Package：Tube
- Logic Type：NAND Gate
- Number of Circuits：4
- Number of Inputs：2
- Features：Schmitt Trigger
- Voltage - Supply：-
- Current - Quiescent (Max)：-
- Current - Output High, Low：-
- Input Logic Level - Low：-
- Input Logic Level - High：-
- Max Propagation Delay @ V, Max CL：-
- Operating Temperature：25°C
- Mounting Type：Surface Mount
- Supplier Device Package：Die
- Package / Case：Die
- Grade：-
- Qualification：-
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Overview
The SN54HC132TDG2 is a quadruple 2-input positive-NAND gate with Schmitt-trigger inputs, manufactured by Texas Instruments. It belongs to the 54HC series and is supplied as a bare die. The device features low static current consumption and operates within a wide voltage range. It is designed for robust performance in demanding environments, offering noise immunity through its Schmitt-trigger input structure.
Feature Summary
- Quadruple 2-input NAND logic function
- Schmitt-trigger inputs for noise filtering
- Bare die configuration for custom packaging
Applications
- Military aerospace systems requiring ruggedized logic
- Custom integrated circuit assemblies
- High-noise industrial control interfaces
Procurement Notes
Verify that the supplier provides traceability documentation for the bare die substrate. Confirm the specific lot code and wafer origin to ensure compliance with military or high-reliability standards. Ensure handling procedures protect the die from electrostatic discharge and mechanical damage during integration into custom packages.
Selection Notes
Select this component when a standard package does not fit the form factor constraints of the application. It serves as a direct functional equivalent to packaged SN54HC132 devices but requires external packaging solutions. Consider thermal management and interconnect reliability when designing the carrier for the bare die.
Part Context
This part is the bare die version of the SN54HC132, a member of the Texas Instruments 54HC family. Unlike the SN74HC132NSR which uses a 14-SOIC package, the TDG2 suffix indicates a die format intended for flip-chip or wire-bond assembly. It shares the same logical functionality as other 54HC132 variants but differs in physical delivery and integration requirements.
Replacement Considerations
Direct replacements include other bare die variants such as SN54HC132TD if available from the manufacturer. For packaged equivalents, the SN54HC132J (14-CDIP) offers the same logic function in a ceramic dual in-line package suitable for similar high-reliability applications.
