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SN65HVD11QPG4 is listed in the Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC TRANSCEIVER HALF 1/1 8PDIP. Review the specifications below when checking this part for your BOM.
The SN65HVD11QPG4 is a 3.3V half-duplex RS-485 transceiver manufactured by Texas Instruments, belonging to the SN65HVD11 series. It integrates one driver and one receiver in an 8-pin TSSOP package. The device supports data rates up to 10 Mb/s with a supply voltage range of 3.0 V to 3.6 V. It features a shutdown mode that reduces operating supply current to less than 1 µA. The component provides 16 kV IEC human-body model ESD protection and operates within a temperature range of -40°C to +125°C.
Verify the specific suffix PG4 indicates lead-free composition and RoHS compliance as per manufacturer standards. Confirm the package type matches the design requirements, as QP denotes a TSSOP form factor. Check current lifecycle status, as availability may vary based on production schedules and obsolescence notices from Texas Instruments.
Select this component when a 3.3V supply is required for RS-485 interfaces with high noise immunity needs. Ensure the application demands half-duplex communication at speeds up to 10 Mb/s. Verify that the TSSOP-8 package fits the PCB layout constraints and that the extended temperature range meets environmental specifications.
This part belongs to the SN65HVD11 family of low-power RS-485 transceivers. It shares functional similarities with other members like the SN65HVD11DG4 but differs in package style. The QP suffix specifically identifies the Thin-Shrink Small-Outline Package (TSSOP), offering a smaller footprint compared to standard SOIC variants within the same electrical specification set.
Direct substitutes include SN65HVD11DRG4 and SN65HVD11DGRG4, which share identical electrical characteristics but utilize SOIC packages. Cross-package replacements require careful review of pin compatibility and thermal performance differences between TSSOP and SOIC footprints.
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