SN65LVDS105D

Overview

The SN65LVDS105D is a clock fanout buffer manufactured by Texas Instruments, designed to convert one LVTTL input signal into four LVDS output signals. It operates within a supply voltage range of 2.4 V to 3.6 V and supports data rates up to 630 Mbps. The device features low propagation delay and high ESD protection exceeding 16 kV. It is housed in an 8-pin SOIC package with dimensions of 4.9 mm x 3.91 mm x 1.58 mm. The component functions reliably across an operating temperature range from -40 °C to +85 °C.

Feature Summary

• Converts single LVTTL input to four differential LVDS outputs for clock distribution
• Provides high electrostatic discharge (ESD) protection exceeding 16 kV
• Supports low voltage TTL levels with 5V tolerance for broad compatibility

Applications

• Clock distribution in wireless base stations
• Timing alignment in network routers
• Point-to-point baseband data transmission on PCB traces or backplanes

Procurement Notes

Verify the specific suffix 'D' corresponds to the tube packaging variant rather than the 'DR' reel variant when sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure the procurement channel provides valid traceability records for quality assurance purposes.

Selection Notes

Select this component when a single LVTTL source must drive multiple LVDS loads with precise timing. It is suitable for designs requiring 5V tolerant inputs interfacing with 3.3V LVDS systems. Consider the 8-pin SOIC package constraints for board layout space and thermal management requirements during the design phase.

Part Context

This part belongs to the SN65LVDS10x series, which includes the SN65LVDS104. While the SN65LVDS104 accepts differential LVDS inputs, the SN65LVDS105 specifically accepts LVTTL inputs. Both share similar electrical characteristics and are intended for high-speed clock fanout applications in telecommunications and networking equipment.

Replacement Considerations

The SN65LVDS105PWG4 serves as a pin-compatible alternative in a TSSOP-16 package. Verify that the pinout configuration matches the target footprint before substitution. Check if the package dimension changes impact the mechanical clearance of the assembly.