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SN74ABT162501DGGR is listed in the Universal Bus Functions range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC UNIV BUS TXRX 18BIT 56TSSOP. Review the specifications below when checking this part for your BOM.
The SN74ABT162501DGGR is an 18-bit universal bus transceiver utilizing Texas Instruments' EPIC-II BiCMOS technology. It integrates D-type latches and flip-flops for transparent, latched, or clocked operation. The device features a flow-through architecture to optimize PCB layout and includes equivalent 25-ohm series resistors at B-port outputs to reduce overshoot and undershoot without external components. It operates within a supply voltage range of 4.5V to 5.5V and maintains high-impedance states during power-up and power-down cycles.
Verify the specific ordering suffix matches the required package type, as the DGGR designation corresponds to the Thin Shrink Small-Outline (DGG) package configuration. Confirm that the component meets the necessary environmental compliance standards for the intended deployment environment. Ensure that input pins are properly terminated to VCC or GND to maintain stable device operation according to manufacturer specifications.
Select this component when an application requires 18-bit bidirectional data transfer with integrated memory functionality. The EPIC-II BiCMOS design offers significantly reduced power dissipation compared to standard CMOS alternatives. Consider the complementary output enable signals and the specific control requirements for latch-enable and clock inputs when designing the system logic.
This device belongs to the Widebus family of universal bus transceivers from Texas Instruments. It is part of the SN74ABT series, which utilizes advanced BiCMOS technology for high performance. The SN74ABT162501DGGR variant specifically provides the 56-pin TSSOP packaging option suitable for surface-mount applications requiring compact form factors.
The SN74ABT162501DLR serves as a pin-compatible alternative in the SSOP package. Verify electrical characteristics and thermal impedance differences between the DGG and DL packages before substitution.
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