SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
SN74ABT18502PMR is listed in the Universal Bus Functions range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC SCAN TEST DEVICE 18BIT 64LQFP. Review the specifications below when checking this part for your BOM.
The SN74ABT18502PMR is a scan test device featuring an 18-bit universal bus transceiver, belonging to the Texas Instruments SCOPE testability IC family. It operates within a supply voltage range of 4.5 V to 5.5 V and supports data rates up to 333 Mbps. The device functions across an extended temperature range from -40°C to +85°C. It is housed in a 64-pin Low-Profile Quad Flat Package (LQFP) with a 10 mm by 10 mm body size. This component integrates registered bus functionality designed for high-speed data transfer applications requiring enhanced testability features.
Verify the specific package variant, as PMR denotes tape-and-reel packaging while APM indicates tray packaging. Confirm that the operating voltage requirements align with the 4.5 V to 5.5 V specification. Ensure compatibility with the LQFP-64 footprint during PCB layout. Check for moisture sensitivity level requirements if the component has been exposed to ambient conditions prior to assembly.
Select this component when an 18-bit wide bus interface with registered outputs is required for testability purposes. It is suitable for systems needing high data throughput up to 333 Mbps. Consider the LQFP-64 package constraints regarding board space and thermal dissipation. Ensure the design environment supports the specified voltage and temperature ranges for reliable operation.
This part belongs to the SN74ABTH18502A series, which is part of the broader SCOPE testability IC family from Texas Instruments. These devices are engineered to facilitate built-in self-test (BIST) and boundary scan methodologies in complex digital designs. The family provides standardized interfaces for testing high-density integrated circuits.
The SN74ABTH18502APM is a pin-compatible alternative offering identical electrical and functional specifications but packaged in a tray instead of tape-and-reel. Verify that the change in packaging format does not impact existing pick-and-place manufacturing processes.
Explore related parts through Logic, Integrated Circuits (ICs), all product categories, ChipApex homepage.