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SN74ABT273NSR is listed in the Flip Flops range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC FF D-TYPE SNGL 8BIT 20SO. Review the specifications below when checking this part for your BOM.
The SN74ABT273NSR is an octal D-type edge-triggered flip-flop manufactured by Texas Instruments within the ABT logic series. It features eight non-inverting outputs and operates on a single supply voltage ranging from 4.5 V to 5.5 V. The component utilizes a 20-pin SOIC package for surface-mount installation. Key electrical specifications include a propagation delay of 6.8 ns, a high-level output current capability of -32 mA, and a low-level output current of 64 mA. It functions with TTL input levels and supports an operating temperature range from -40°C to +85°C.
Verify the specific ordering suffix 'SR' corresponds to the tape-and-reel packaging format required for automated assembly processes. Confirm that the device variant matches the standard commercial grade specifications rather than extended temperature or military grades. Ensure compatibility with existing PCB footprint designs utilizing the 20-SOIC package dimensions before finalizing procurement orders.
Select this component when designing systems requiring parallel data storage with high-speed clocking capabilities. The ABT series offers superior performance compared to standard 74HC families while maintaining pinout compatibility. Consider the 6.8 ns propagation delay and current drive limits to ensure signal integrity meets system timing requirements.
This part belongs to the Texas Instruments SN74ABT family of BiCMOS logic devices. The ABT series combines the speed advantages of bipolar technology with CMOS power efficiency. The SN74ABT273 specifically addresses the need for wide-word data registers in complex digital logic designs requiring reliable edge-triggered operation.
Compatible substitutes include the SN74ABT273N (PDIP package) and SN74ABT273DBR (SSOP package). Verify package type and mounting style differences when replacing surface-mount variants with through-hole options.
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