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SN74ABT574ADWR is listed in the Flip Flops range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC FF D-TYPE SNGL 8BIT 20SOIC. Review the specifications below when checking this part for your BOM.
The SN74ABT574ADWR is an octal edge-triggered D-type flip-flop manufactured by Texas Instruments. It belongs to the ABT logic series and features three-state outputs with non-inverting polarity. The device operates within a supply voltage range of 4.5 V to 5.5 V and supports a maximum clock frequency of 200 MHz. Key electrical parameters include a propagation delay of 6.6 ns, high-level output current of -32 mA, and low-level output current of 64 mA. It is housed in a 20-SOIC package and functions within an operating temperature range of -40°C to +85°C.
Verify the specific suffix 'DWR' corresponds to the SOIC-20 surface-mount package variant when sourcing. Confirm RoHS compliance status through official manufacturer documentation or authorized distributor datasheets prior to integration. Ensure the selected component matches the required thermal and electrical specifications for the target application environment.
Select this component for applications requiring high-density octal storage with fast switching speeds. Compare against SN74ABT574AN for through-hole requirements or SN74LVT574DWR for lower voltage operation. Validate that the 4.5V minimum supply voltage aligns with the system power architecture before finalizing the design.
This part is a member of the SN74ABT574A family, which includes variants such as SN74ABT574ADBR (SSOP) and SN74ABT574AN (PDIP). All variants share identical logical functionality and electrical characteristics, differing primarily in physical packaging and mounting style. The 'W' suffix specifically denotes the wide SOIC package format.
SN74ABT574ADBR offers equivalent electrical performance in a 20-SSOP package. SN74ABT574AN provides the same functionality in a 20-PDIP through-hole package. Substitution requires verifying pinout compatibility and mechanical fit within the existing PCB layout constraints.
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