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SN74ACT244NS is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is BUFF/DVR TRI-ST DUAL 20SO. Review the specifications below when checking this part for your BOM.
The SN74ACT244NS is an octal buffer and line driver manufactured by Texas Instruments, belonging to the ACT logic series. It features eight non-inverting inputs and outputs with three-state capability, housed in a 20-pin SOIC package. The device operates within a supply voltage range of 4.5 V to 5.5 V, supporting TTL-compatible inputs. Key electrical parameters include a maximum propagation delay of 9 ns at 5 V, output currents of ±24 mA, and a static current of 4 µA. It functions across a temperature range of -40°C to +85°C.
Verify the specific suffix against the manufacturer's current datasheet to confirm package type and environmental compliance. Confirm availability status as some variants may be discontinued or subject to obsolescence notices. Ensure the ordering part number matches the required lead time and packaging format for production integration.
Select this component for applications requiring high-speed signal buffering with strong drive capabilities. The ACT series offers a balance of speed and low power consumption compared to older logic families. Verify that the system voltage aligns with the 4.5 V to 5.5 V operating range and that thermal constraints fit within the commercial grade temperature limits.
This device is part of the broader SNx4ACT244 family of octal buffers and drivers. It shares functional similarities with other members like the SN74ACT244DW and SN74ACT244PWR, differing primarily in package style and manufacturing revision. The ACT series represents an advancement over standard 74LS logic, offering faster switching speeds while maintaining CMOS power efficiency.
Compatible substitutes include SN74ACT244DW, SN74ACT244PWR, and SN74ACT244DWRG4. These alternatives share identical logical functionality and pinouts but differ in package form factor such as SOIC, TSSOP, or VSSOP. Verify mechanical dimensions and thermal characteristics before substitution.
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