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The SN74ACT563DW is an octal transparent latch from the Texas Instruments SN74ACT series, housed in a 20-pin SOIC package. It features eight D-type inputs and corresponding inverted outputs with tri-state capability controlled by an output enable input. The device operates within a supply voltage range of 4.5 V to 5.5 V, drawing a maximum static current of 4 µA. Key electrical specifications include a propagation delay of 11.5 ns, a low-level output current of 32 mA, and a high-level output current of -24 mA. It supports surface-mount installation and functions reliably across an operating temperature range of -40°C to +85°C.
Verify the exact suffix against the manufacturer's official documentation to confirm package type and tape/reel specifications. Ensure the component meets RoHS compliance requirements for your region. Cross-reference the ordering part number with the latest datasheet revision to avoid discrepancies in pinout or electrical characteristics. Confirm availability through authorized distributors to guarantee authenticity.
Select this component when designing systems requiring octal data retention with active-high transparency. The ACT series offers faster switching speeds compared to standard LS counterparts while maintaining CMOS low power consumption. Consider the 20-pin SOIC footprint for PCB layout constraints. Verify that the load capacitance and drive requirements align with the specified 32 mA and -24 mA output currents.
This device belongs to the SN74ACT family of advanced CMOS logic, designed to bridge the performance gap between TTL and AC logic families. It shares functional similarities with other octal latches like the SN74ACT573 but differs in output polarity and specific timing characteristics. The SN74ACT563 is distinct from flip-flops such as the SN74ACT374 due to its level-sensitive transparent operation rather than edge-triggered behavior.
Check for SN74ACT563DR as a reel-packaged alternative from the same manufacturer. Verify cross-compatibility with SN74ACT563N if through-hole packaging is required instead of surface mount. Ensure any substitute maintains the same 20-pin SOIC footprint and electrical parameters.