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SN74ACT7204L20NP is listed in the FIFOs Memory range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC FIFO ASYNC 4KX9 28DIP. Review the specifications below when checking this part for your BOM.
The SN74ACT7204L20NP is an asynchronous FIFO memory device manufactured by Texas Instruments. It features a storage capacity of 4K words with a 9-bit width, organized as 4096 x 9 bits. The component utilizes a 28-pin PDIP package and operates within a supply voltage range of 4.5 V to 5.5 V. It supports TTL-compatible inputs and CMOS outputs, ensuring interface compatibility with standard logic families.
Verify the obsolete status before procurement, as production has been discontinued by the manufacturer. Confirm availability through authorized distributors or surplus suppliers. Ensure the 28-pin PDIP package matches your PCB footprint requirements. Check for moisture sensitivity level 3 compliance if reflow soldering is required. Validate that the 4.5 V to 5.5 V operating range suits your system power design.
Select this component when asynchronous FIFO functionality with 9-bit word width is required. The ACT series offers improved speed over standard LS logic while maintaining CMOS low power consumption. Consider the 28-pin DIP package for prototyping or through-hole applications. Verify that the asynchronous nature fits your timing constraints compared to synchronous alternatives.
This part belongs to the SN74ACT family of advanced CMOS logic devices from Texas Instruments. The ACT series provides high-speed performance with low power dissipation. The SN74ACT7204 variant specifically addresses memory buffering needs. The L20NP suffix indicates the specific package type and temperature rating configuration defined by the manufacturer.
The manufacturer has discontinued this part. No direct public substitute part numbers are confirmed in available documentation. Evaluate compatible asynchronous FIFOs from other manufacturers or newer generations within the same family if available.
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