SN74ALS1035N

Overview

The SN74ALS1035N is a hex noninverting buffer with open-collector outputs manufactured by Texas Instruments. It belongs to the SN74ALS logic family, providing high-speed performance in a 16-pin DIP package. The device operates within a supply voltage range of 4.5 V to 5.5 V and supports an operating temperature range from 0°C to +70°C. Key electrical characteristics include a low-level output current capability of 8 mA and a propagation delay typical of the ALS series.

Feature Summary

• Hex noninverting buffer configuration
• Open-collector output structure
• High-speed ALS logic performance

Applications

• Digital signal buffering
• Line driving applications
• Logic level translation interfaces

Procurement Notes

Verify the specific suffix 'N' confirms the 16-pin DIP package variant. Confirm RoHS compliance status through official documentation as requirements vary by production batch. Ensure the supplier provides valid traceability for the Texas Instruments manufacturing origin. Cross-reference the datasheet revision date to ensure compatibility with current design specifications.

Selection Notes

Select this component when hex buffering with open-collector outputs is required. The ALS series offers a balance of speed and power consumption suitable for general digital logic. Verify that the load capacitance and pull-up resistor values are compatible with the open-collector architecture. Ensure the system voltage remains within the specified 4.5 V to 5.5 V range for reliable operation.

Part Context

This part is part of the SN74ALS family, designed for high-speed digital applications. It serves as a buffer or line driver in systems requiring signal isolation or drive strength enhancement. The open-collector outputs allow for wired-OR connections and flexibility in interfacing with different voltage levels via external pull-up resistors.

Replacement Considerations

Compatible substitutes include other hex buffers with open-collector outputs from the same logic family. Verify pinout compatibility before substitution. Alternative packages such as SOIC may be considered if form factor changes are acceptable.