SN74ALVC162836DLR

Overview

The SN74ALVC162836DLR is a 20-bit universal bus driver manufactured by Texas Instruments. It operates within a supply voltage range of 1.65V to 3.6V and features 3-state outputs. The device utilizes ALVC technology, achieving a maximum propagation delay of 4.6ns at nominal voltage. It supports an operating temperature range from -40°C to +85°C and is housed in a 56-pin SSOP package.

Feature Summary

• Provides 20-bit bidirectional data transfer capability via universal bus architecture
• Features 3-state outputs for effective bus line management and isolation
• Supports low-voltage operation down to 1.65V for power efficiency

Applications

• High-density memory mapping systems
• Portable consumer electronics requiring low power consumption
• Industrial control systems with multiple I/O expansion requirements

Procurement Notes

Verify the specific suffix 'DLR' corresponds to the tape-and-reel packaging configuration required for automated assembly processes. Confirm that the component meets RoHS compliance standards relevant to your manufacturing region. Ensure the ordering quantity aligns with standard reel sizes to avoid partial reel handling issues during production.

Selection Notes

Select this component when a high-channel-count bus interface is necessary within strict space constraints. The SSOP-56 package offers a compact footprint suitable for dense PCB layouts. Consider the ALVC series characteristics for applications demanding faster switching speeds compared to standard LVC devices while maintaining compatibility with 3.3V logic families.

Part Context

This part belongs to the Texas Instruments SN74ALVC16xxx series of 16-bit and 20-bit bus drivers. These components are designed to replace older 5V logic families in modern low-voltage digital systems. The SN74ALVC162836 specifically addresses the need for wide data path buffering in portable and battery-operated equipment where power conservation is critical.

Replacement Considerations

The SN74ALVC162836DLRG4 is a verified equivalent variant offering identical electrical specifications and pinout compatibility. Verify package dimensions and thermal characteristics when substituting to ensure mechanical fit within the existing enclosure design.