SN74ALVCH16260DGGR

Overview

The SN74ALVCH16260DGGR is a 12-bit to 24-bit multiplexed D-type latch with 3-state outputs from the Texas Instruments Widebus family. Designed for 1.65-V to 3.6-V VCC operation, it features three 12-bit I/O ports (A1-A12, 1B1-1B12, and 2B1-12) for address or data transfer. The device utilizes an EPIC submicron process and includes active bus-hold circuitry on data inputs. It operates within a temperature range of -40°C to 85°C.

Feature Summary

• Multiplexes two separate data paths onto or demultiplexes from a single path using internal storage latches controlled by LE1B, LE2B, LEA1B, and LEA2B inputs.
• Incorporates active bus-hold circuitry on data inputs to maintain valid logic levels without requiring external pullup or pulldown resistors.
• Provides ESD protection exceeding 2000 V per MIL-STD-883 Method 3015 and latch-up performance exceeding 250 mA per JESD 17.

Applications

• Multiplexing and demultiplexing address and data information in microprocessor applications
• Bus-interface applications requiring dual data path management
• Memory-interleaving applications

Procurement Notes

Verify the specific ordering suffix 'DGGR' corresponds to the TSSOP (DGG) package with 2000-unit large tape and reel quantity. Confirm that the RoHS status is compliant and the moisture sensitivity level is rated as Level-1. Ensure the operating temperature range requirement aligns with the specified -40°C to 85°C limits before finalizing procurement.

Selection Notes

Select this component when designing systems requiring the simultaneous handling of two distinct 12-bit data streams through a shared interface. The device is suitable for low-voltage environments operating between 1.65 V and 3.6 V. Consider its high-speed propagation characteristics and the necessity for internal data storage capabilities during signal routing.

Part Context

This part belongs to the Texas Instruments 74ALVCH series, utilizing Enhanced-Performance Implanted CMOS (EPIC) technology. It is part of the Widebus family designed for high-density digital logic applications. The DGGR suffix specifically denotes the Thin Shrink Small-Outline (TSSOP) package configuration.

Replacement Considerations

The SN74ALVCH16260DL serves as a pin-compatible alternative housed in a Plastic Shrink Small-Outline (SSOP) package. Verify package dimensions and thermal impedance differences when substituting between the DGG and DL variants.