SN74ALVCH16260DL

Overview

The SN74ALVCH16260DL is a 12-bit to 24-bit multiplexed D-type latch with 3-state outputs, designed for 1.65-V to 3.6-V VCC operation. It features three 12-bit I/O ports (A1-A12, 1B1-1B12, and 2B1-12) for address and data transfer. The device utilizes active bus-hold circuitry on data inputs to eliminate the need for external pullup/pulldown resistors. It is characterized for operation from -40°C to 85°C.

Feature Summary

• Multiplexes two separate 12-bit data paths onto or demultiplexes them from a single 24-bit path using internal storage latches controlled by LE1B, LE2B, LEA1B, and LEA2B inputs.
• Includes active bus-hold circuitry on all data inputs to maintain valid logic levels for unused or floating pins without external components.
• Provides ESD protection exceeding 2000 V per MIL-STD-883 Method 3015 and latch-up performance exceeding 250 mA per JESD 17.

Applications

• Multiplexing and demultiplexing address and data information in microprocessor applications
• Bus-interface applications requiring combined address/data handling
• Memory-interleaving applications

Procurement Notes

Verify the DL package designation corresponds to the Plastic Shrink Small-Outline (SSOP) format with 56 pins. Confirm that the specific orderable part number matches the required tube packaging quantity of 20 units. Ensure compatibility with the -40°C to 85°C operating temperature range specified for this variant.

Selection Notes

Select this component when a single chip must handle both 12-bit and 24-bit data widths via multiplexing. The ALVCH series supports low-voltage logic interfaces ranging from 1.65 V to 3.6 V. The SSOP package offers a compact footprint suitable for space-constrained designs requiring high-density pin counts.

Part Context

This device belongs to Texas Instruments' Widebus family, utilizing the EPIC submicron CMOS process. It serves as a specialized latch solution distinct from standard bus transceivers by integrating dual 12-bit banks into a unified 24-bit architecture. The DL package variant provides a shrink small-outline form factor compared to the TSSOP alternative.

Replacement Considerations

SN74ALVCH16260DGGR