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The SN74ALVCH373GQNR is an octal transparent D-type latch manufactured by Texas Instruments, belonging to the ALVCH logic series. It operates within a supply voltage range of 1.65 V to 3.6 V and features tri-state outputs with bus hold functionality on data inputs. The device utilizes a 20-pin Microstar Junior BGA package (4x3 mm) suitable for surface-mount applications. Key electrical parameters include a maximum propagation delay of 3.3 ns at 3.3 V, ±24 mA output drive capability, and a static current of 20 µA. It supports a wide operating temperature range from -40°C to +85°C.
Verify the specific ordering suffix GQNR corresponds to the 20-pin Microstar Junior BGA package configuration. Confirm that the component meets RoHS compliance requirements for your target market regulations. Ensure the datasheet revision matches your design specifications regarding electrical characteristics and thermal performance. Cross-reference the manufacturer part number with authorized distributors to guarantee authenticity and traceability.
Select this component when designing circuits that require low-voltage operation between 1.65 V and 3.6 V. It is suitable for applications demanding high-speed data latching with minimal power dissipation. Consider the small form factor of the Microstar Junior package for space-constrained PCB layouts. Evaluate the ±24 mA output drive against load requirements to ensure signal integrity without external buffering.
This part belongs to the SN74ALVCH373 family of octal transparent D-type latches. The ALVCH series is designed for low-voltage applications, offering improved performance over standard CMOS technologies while maintaining compatibility with legacy systems. The GQNR suffix specifically denotes the BGA package variant, distinguishing it from other packaging options like TVSOP or standard BGA configurations available within the same logical family.
SN74ALVCH373DGVR offers identical electrical specifications but uses a TVSOP-20 package instead of BGA. SN74ALVCH373ZQNR provides the same logic function in a different BGA footprint. Verify pinout compatibility and thermal management requirements before substituting these alternatives.