SN74AUC1G02YEPR

Overview

The SN74AUC1G02YEPR is a single 2-input positive-NOR gate from the Texas Instruments AUC logic family, housed in a NanoFree YZP (DSBGA) package. It operates within a supply voltage range of 0.8 V to 2.7 V and supports mixed-mode signal operation with inputs tolerant up to 3.6 V. The device features low power consumption with a maximum quiescent current of 10 μA and includes Ioff circuitry for partial-power-down applications. Electrical characteristics include a propagation delay of 2.4 ns at 1.8 V with a 30 pF load, output drive currents of ±9 mA, and an input capacitance of 3 pF.

Feature Summary

• Performs Boolean NOR logic function using CMOS technology optimized for sub-1-V operation.
• Incorporates Ioff circuitry to disable outputs and prevent backflow during partial-power-down states.
• Provides ESD protection exceeding JESD 22 standards for robustness in mixed-signal environments.

Applications

• Mixed-mode signal processing circuits requiring level translation between different voltage domains.
• Portable battery-powered devices necessitating ultra-low standby power consumption.
• High-density digital logic implementations utilizing compact NanoFree packaging.

Procurement Notes

Verify that the ordering suffix matches the specific package variant required, as the base part number covers multiple form factors including DSBGA, SOT-23, and SC-70. Confirm the moisture sensitivity level and reflow temperature profile aligns with your assembly process specifications. Ensure the component status is listed as active production data before finalizing procurement plans.

Selection Notes

Select this component when a single NOR gate is required in a minimal footprint for space-constrained designs. It is suitable for systems operating between 0.8 V and 2.7 V where low static power is critical. Consider the YZP package dimensions if board real estate is limited, noting its die-as-package construction.

Part Context

This device belongs to the SN74AUC1G series of Little Logic devices, designed for high-speed, low-voltage applications. The AUC family utilizes advanced CMOS processes to achieve performance comparable to older technologies while significantly reducing power dissipation. The NanoFree packaging represents a shift toward maximizing board space efficiency by exposing the die directly.

Replacement Considerations

Direct pin-compatible alternatives within the same family include SN74AUC1G02DBVR (SOT-23), SN74AUC1G02DCKR (SC-70), and SN74AUC1G02DRLR (SOT-553). Verify electrical parameters and thermal characteristics match your design requirements when substituting package types.