SN74AUC1G08YZPR

Overview

The SN74AUC1G08YZPR is a single 2-input positive-AND gate from the Texas Instruments AUC logic family. It operates within a supply voltage range of 0.8 V to 2.7 V and is optimized for 1.65-V to 1.95-V applications. The device features a maximum propagation delay of 2.4 ns at 1.8 V with a 30-pF load. It supports partial-power-down mode via Ioff circuitry, which disables outputs to prevent backflow current. The component utilizes the NanoFree™ DSBGA package.

Feature Summary

• Operates at sub-1-V supply voltages down to 0.8 V
• Includes Ioff circuitry for partial-power-down support
• Provides high ESD protection ratings across multiple test standards
• Features latch-up performance exceeding specified industry limits

Applications

• Portable audio devices such as MP3 players and recorders
• Solid-state drives for client and enterprise systems
• Wireless peripherals including headsets, keyboards, and mice
• Embedded PC and personal digital assistant (PDA) systems

Procurement Notes

Verify the specific ordering suffix YZPR to confirm the DSBGA package type and 3000-unit reel quantity. Ensure compatibility with the required operating temperature range of -40°C to +85°C. Confirm RoHS compliance status and lead finish specifications against project requirements before finalizing procurement orders.

Selection Notes

Select this component when designing mixed-mode signal circuits requiring 3.6-V I/O tolerance alongside low-voltage logic operation. The NanoFree™ package offers significant size reduction compared to standard SOT-23 or SC-70 alternatives. Consider the specific propagation delay characteristics under varying capacitive loads during system timing analysis.

Part Context

This part belongs to the SN74AUC1G08 series, representing a single-gate variant within the broader AUC logic family. While other packages like SOT-23 and SC-70 exist for the same logical function, the YZPR suffix specifically denotes the die-size ball grid array configuration. This packaging technology integrates the silicon die directly into the package structure.

Replacement Considerations

Direct functional equivalents include SN74AUC1G08DBVR and SN74AUC1G08DCKR. These parts share identical electrical specifications but utilize different physical packages. Verify pinout compatibility and thermal resistance differences when substituting these components in existing designs.