SN74AUC2G08YEPR

Overview

The SN74AUC2G08YEPR is a dual 2-input positive-AND gate from the Texas Instruments AUC logic series, housed in an 8-pin NanoFree (DSBGA/YZP) package. It operates within a supply voltage range of 0.8 V to 2.7 V and supports mixed-mode signal operation with inputs tolerant up to 3.6 V. The device features low power consumption of 10 μA at 1.8 V, ±8 mA output drive capability, and a maximum propagation delay of 1.5 ns at 1.8 V. It includes Ioff support for partial-power-down applications and provides ESD protection exceeding 2000 V via the human-body model.

Feature Summary

• Performs Boolean AND function (Y = A • B) using positive logic
• Supports mixed-mode signal operation with 3.6-V I/O tolerance
• Enables partial-power-down mode through integrated Ioff circuitry

Applications

• Mixed-mode signal level translation between sub-1-V and 3.6-V domains
• Low-voltage digital logic processing in portable electronics
• Partial-power-down system configurations requiring output isolation

Procurement Notes

Verify that the specific ordering suffix matches the required package type and lead finish. Confirm the component status is designated as active production data rather than preproduction or experimental. Ensure the procurement channel sources parts directly from authorized distributors to guarantee authenticity and adherence to standard warranty terms.

Selection Notes

Select this component when designing circuits requiring high-speed logic operations at supply voltages below 1.8 V. The NanoFree package is suitable for applications demanding minimal footprint and low profile. Consider the 3.6-V input tolerance if interfacing with higher voltage logic families without additional level shifting components.

Part Context

This device belongs to the SN74AUC2Gxx family of Little Logic devices designed for ultra-low voltage applications. The YZP suffix indicates the DSBGA package configuration utilizing solder bumps instead of traditional leads. This packaging technology allows for direct die attachment, reducing size and improving thermal performance compared to standard plastic packages.

Replacement Considerations

SN74AUC2G08YZPR