SN74AUC2G08YZTR

Overview

The SN74AUC2G08YZTR is a dual 2-input positive-AND gate from the Texas Instruments AUC logic series, housed in an 8-pin NanoFree (DSBGA/YZP) package. It operates within a supply voltage range of 0.8 V to 2.7 V and supports mixed-mode I/O tolerant up to 3.6 V. The device features low power consumption with a typical quiescent current of 10 μA at 1.8 V. Propagation delay is optimized for high-speed operation, reaching a maximum of 1.5 ns at 1.8 V with a 15 pF load. It includes Ioff circuitry to support partial-power-down modes.

Feature Summary

• Dual 2-input AND logic function implemented in a compact NanoFree package
• Low power consumption with 10-μA quiescent current at 1.8 V
• Ioff circuitry prevents damaging backflow during partial-power-down states
• Mixed-mode signal interface supporting 3.6-V inputs on 0.8-V to 2.7-V devices

Applications

• Portable battery-powered consumer electronics
• Mixed-voltage signal translation between subsystems
• High-density digital logic circuits requiring minimal footprint
• Partial-power-down applications in mobile communication devices

Procurement Notes

Verify the YZP package designation matches the required DSBGA form factor for PCB layout compatibility. Confirm that the ordering suffix corresponds to the specific reel quantity and tape-and-reel specifications needed for automated assembly processes. Ensure the component meets RoHS compliance requirements for the target manufacturing region.

Selection Notes

Select this component when space constraints necessitate the use of the NanoFree package over standard SSOP or VSSOP alternatives. Consider the 3.6-V input tolerance if interfacing with higher voltage logic domains while operating the core at lower voltages. Evaluate the propagation delay characteristics against system timing requirements to ensure adequate performance margins.

Part Context

This part belongs to the SN74AUC2G08 family of sub-1-V Little Logic devices designed for ultra-low voltage applications. The AUC series focuses on reducing power dissipation while maintaining high switching speeds suitable for modern portable devices. The NanoFree technology utilizes the die as the package to achieve significant size reduction compared to traditional plastic packages.

Replacement Considerations

SN74AUC2G08YZPR serves as the primary equivalent variant within the same product line.