SN74AUC2G32YZPRB

Overview

The SN74AUC2G32YZPRB is a dual 2-input positive-OR gate from the Texas Instruments AUC logic series, housed in a NanoFree YZP package. It operates within a supply voltage range of 0.8 V to 2.7 V and supports an operating temperature range of -40°C to +85°C. The device features low power consumption with a typical quiescent current of 10 μA at 1.8 V. Output drive capabilities include ±8 mA at 1.8 V, while propagation delay reaches a maximum of 1.5 ns at 1.8 V. Latch-up performance exceeds 100 mA per JESD 78, Class II standards.

Feature Summary

• Supports partial-power-down mode via Ioff circuitry to prevent damaging backflow currents when powered down
• NanoFree packaging technology utilizes the die as the package for compact footprint integration
• Provides ESD protection exceeding 2000-V human-body model and 200-V machine model ratings

Applications

• Mixed-mode signal operation supporting 1.8-V systems with 3.6-V I/O tolerance
• Portable and battery-powered electronics requiring sub-1-V operability
• High-density digital circuits utilizing NanoFree package space efficiency

Procurement Notes

Verify the specific ordering suffix against the manufacturer's Package Option Addendum to confirm the exact tape-and-reel quantity and lead finish specifications. Ensure the selected variant matches the required moisture sensitivity level and peak reflow temperature parameters for your assembly process. Cross-reference the part marking codes to validate the assembly site and production status before finalizing procurement orders.

Selection Notes

Select this component for designs requiring high-speed OR logic within extremely tight spatial constraints due to the NanoFree form factor. It is suitable for applications demanding low standby power and robust latch-up immunity in mixed-voltage environments. Consider the specific output drive requirements at varying supply voltages to ensure adequate noise margins for the target load conditions.

Part Context

This device belongs to the SN74AUC2G family of Little Logic devices designed for ultra-low voltage operation. The AUC series focuses on minimizing power consumption while maintaining fast switching speeds compared to legacy logic families. The YZP package represents a wafer-scale chip-scale packaging solution distinct from standard surface-mount packages like VSSOP or SSOP.

Replacement Considerations

SN74AUC2G32YZPR