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The SN74CBT3257DBQRE4 is a 4-bit 1-of-2 FET multiplexer/demultiplexer manufactured by Texas Instruments. It operates within a supply voltage range of 4 V to 5.5 V and supports an operating temperature range from -40°C to 85°C. The device features TTL-compatible input levels, ensuring compatibility with standard logic families. Key electrical characteristics include a maximum on-state resistance (ron) of 7 Ω at VCC = 4.5 V and VI = 0 V, and a typical propagation delay (tpd) of 0.25 ns at VCC = 5 V with a 50 pF load. The package type is SSOP (QSOP) DBQ with 16 pins.
Verify the specific ordering suffix 'E4' against current Texas Instruments documentation to confirm lead-free status and RoHS compliance details. Confirm that the DBQ package designation matches the required shrink small-outline footprint for your PCB layout. Ensure the operating temperature range of -40°C to 85°C meets your environmental specifications. Cross-reference the obsolete status listed in recent addenda with your long-term supply requirements.
Select this component when a low-resistance, high-speed 4-bit switch is required within a 5 V logic environment. The DBQ package offers a compact form factor suitable for space-constrained designs. Consider the TTL-compatible input thresholds if interfacing directly with older logic families without level shifting. Evaluate the 7 Ω max on-resistance against your signal integrity requirements for high-frequency applications.
This part belongs to the SN74CBT3257 family of low-voltage FET multiplexers. It is functionally equivalent to other variants like SN74CBT3257DBQR but may differ in packaging or environmental certifications due to the 'E4' suffix. The family is designed for applications requiring fast switching speeds and low power consumption in portable and battery-operated devices.
Direct substitutes include SN74CBT3257DBQR and SN74CBT3257DBR, though these are marked as obsolete in recent TI documentation. Verify pinout compatibility and electrical parameters before substitution. Alternative packages such as SOIC (D) or TSSOP (PW) require different footprints and are not direct drop-in replacements without PCB redesign.