SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The SN74CBTLV3383DW is a low-voltage 10-bit FET bus switch manufactured by Texas Instruments. It operates within a supply voltage range of 2.3 V to 3.6 V and features a maximum on-resistance of 27 Ohms. The device exhibits a maximum propagation delay of 250 ps, ensuring high-speed signal integrity. Designed for surface-mount applications, it is housed in a SOIC-24 package. The component supports an operating temperature range from -40°C to +85°C, making it suitable for commercial and industrial environments requiring efficient data routing.
Verify the specific suffix 'DW' corresponds to the SOIC-24 package configuration before procurement. Confirm RoHS compliance status through official manufacturer documentation or authorized distributor certificates. Ensure the ordering part number matches the required lead time and production cycle specifications provided by the supplier. Cross-reference the datasheet revision history to validate electrical characteristics against current design requirements.
Select this component when designing circuits that require ten independent bidirectional switches within a single package footprint. The low on-resistance and fast propagation delay make it appropriate for high-frequency digital bus applications. Verify that the system supply voltage remains within the 2.3 V to 3.6 V operational window. Consider the SOIC-24 thermal performance and pinout compatibility with existing PCB footprints during the integration phase.
This device belongs to the SN74CBTLV3383 series of low-voltage bus switches. It serves as a specialized solution for managing multiple data lines in space-constrained electronic designs. The series is characterized by its ability to handle signals across various low-voltage logic families while maintaining signal integrity through minimal insertion loss and controlled impedance paths.
The SN74CBTLV3383DWR is available as a tape-and-reel alternative offering identical electrical performance and pinout compatibility. Both variants share the same functional specifications and package dimensions, allowing for direct substitution based on manufacturing packaging preferences without altering the circuit design.