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SN74F125NS is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUFFER NON-INVERT 5.5V 14SO. Review the specifications below when checking this part for your BOM.
The SN74F125NS is a quad bus buffer gate featuring three-state outputs, manufactured by Texas Instruments. It operates within a supply voltage range of 4.5 V to 5.5 V and utilizes the F logic series technology. The device provides four non-inverting input lines corresponding to four output channels. Key electrical characteristics include a high-level output current of -15 mA and a low-level output current of 64 mA. Propagation delay is specified at 7.5 ns when operating at 5 V. The component is housed in a 14-pin SOIC package and supports surface-mount installation.
Verify the specific suffix designation against official documentation, as variations may indicate differences in packaging or temperature ratings. Confirm RoHS compliance status through the manufacturer's latest product information page. Ensure the ordering part number matches the required package type and reel specifications for your assembly process.
Select this component when designing systems requiring high-speed buffering with strong low-level sink capability. The F-series technology offers faster propagation delays compared to LS equivalents. Consider the 14-SOIC package dimensions for PCB layout constraints. Verify that the 4.5 V to 5.5 V supply range aligns with the target system voltage.
This device belongs to the SN74F125 family of quadruple bus buffers with three-state outputs. It is part of the broader 74xx logic series, specifically utilizing Fast (F) bipolar technology. Similar devices in the lineup include variants with different voltage tolerances or input types, such as HCT or AHCT families, which offer compatibility with different logic levels.
Compatible substitutes include SN74F125D and SN74F125N. These alternatives share identical logical functionality and pinout configurations. Verify package compatibility and thermal performance before substitution.
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