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The SN74HC04PWT is a hex inverter integrated circuit manufactured by Texas Instruments, belonging to the 74HC series of high-speed CMOS logic devices. It contains six independent inverters within a single package. The device operates with a supply voltage range of 2V to 6V and supports a wide operating temperature range from -40°C to +85°C. Key electrical characteristics include a maximum propagation delay of 16ns at 6V with a 50pF load and a static current consumption of up to 2µA. The output drive capability is specified at 5.2mA for both high and low states. It is housed in a 14-TSSOP surface-mount package.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific suffix PWT corresponds to the 14-TSSOP package variant. Check for RoHS compliance status and ensure the part meets environmental regulations required for your assembly process. Validate that the supplier provides valid traceability documentation for quality assurance purposes.
Select this component when six independent inverters are required in a compact surface-mount form factor. Ensure the design voltage requirements fall within the 2V to 6V operational range. Consider the 16ns propagation delay specification for timing-critical applications. Verify that the 14-TSSOP footprint matches the PCB layout constraints and thermal management requirements of the target system.
This device is part of the broader 74HC04 family, which includes variants with different packaging options such as SOIC, PDIP, and TSSOP. The PWT suffix specifically denotes the 14-pin Thin-Shrink Small-Outline Package (TSSOP). Other family members may share identical internal logic but differ in physical dimensions, pin pitch, or mounting style to accommodate diverse board space limitations.
Direct substitutes include SN74HC04PWR and SN74HC04PWRE4, which offer equivalent logical functionality and similar electrical specifications. Alternative packages like SN74HC04DT provide the same logic in an SOIC format. Verify pin compatibility and thermal performance before substituting across different package types.