SN74HC139DBR

Overview

The SN74HC139DBR is a dual 2-line to 4-line decoder/demultiplexer from the Texas Instruments HC logic family, housed in a 16-pin SSOP package. It operates within a supply voltage range of 2 V to 6 V and supports an operating temperature range of -40°C to +85°C. The device features fully buffered inputs and active-low outputs. Key electrical characteristics include a typical propagation delay of 10 ns at 5 V, low power consumption with a maximum ICC of 80 μA, and output drive capabilities of ±4 mA at 5 V.

Feature Summary

• Designed for high-speed memory decoders and data-transmission systems
• Incorporates two enable inputs to simplify cascading and data reception
• Features fully buffered inputs representing only one normalized load

Applications

• High-performance memory decoding
• Data-routing applications
• Demultiplexing circuits

Procurement Notes

Verify that the ordering suffix 'DBR' corresponds to the SSOP-16 package and tape-and-reel carrier configuration. Confirm RoHS compliance and lead finish specifications (NIPDAU) against current TI documentation. Ensure the moisture sensitivity level rating aligns with assembly requirements.

Selection Notes

Select this component when a dual 2-to-4 decoder is required in a compact surface-mount form factor. The HC series offers wide voltage flexibility compared to fixed-voltage logic families. Verify that the 2 V to 6 V operating range matches the system power rails and that the -40°C to +85°C temperature range satisfies environmental constraints.

Part Context

This part belongs to the SNx4HC139 family of dual decoders. Other available packages for this function include SOIC (DR), TSSOP (PWR), and PDIP (N). The SN74HC139DBR specifically utilizes the SSOP package variant, offering a smaller footprint than standard SOIC while maintaining similar pinout functionality.

Replacement Considerations

Direct functional equivalents include SN74HC139DR (SOIC package) and SN74HC139PWR (TSSOP package). Cross-package replacements require verifying pin compatibility and thermal performance differences.