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SN74HC164NS is listed in the Shift Registers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is LOGIC GATES AND INVERTERS. Review the specifications below when checking this part for your BOM.
The SN74HC164NS is an 8-bit parallel-out serial shift register manufactured by Texas Instruments in a 14-pin Small Outline (SO) package. It operates within a supply voltage range of 2 V to 6 V and supports an operating temperature range from -40°C to 125°C. The device features AND-gated serial inputs (A and B), an asynchronous clear (CLR) input, and fully buffered clock and serial inputs. Typical propagation delay is 20 ns, with output drive capabilities of ±4 mA at 5 V.
Verify the specific ordering suffix 'NS' corresponds to the 14-pin SO package variant when sourcing. Confirm the required operating temperature grade matches the application environment, as industrial ratings extend to 125°C while commercial grades may differ. Ensure power supply decoupling capacitors are placed close to the VCC pin to maintain signal integrity during high-speed operation.
Select this component when a low-power CMOS shift register with parallel output is required for serial-to-parallel conversion. The dual gated serial inputs allow flexible data enable logic without external gating components. Verify that the maximum clock frequency requirements at the target supply voltage fall within the specified switching characteristics for reliable timing performance.
This part belongs to the SNx4HC164 family of 8-bit shift registers produced by Texas Instruments. The 'SN' prefix indicates standard commercial-grade processing, while 'HC' denotes High-speed CMOS technology. The 'NS' suffix specifically identifies the 14-pin Small Outline package format, distinguishing it from PDIP or TSSOP variants within the same functional family.
Direct replacements include SN74HC164N (PDIP) and SN74HC164D (SOIC). Cross-manufacturer equivalents such as MC74HC164ANG or MM74HC164MTCX offer identical functionality but require verification of package dimensions and thermal characteristics.
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