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SN74LVC07APWRE4 is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUF NON-INVERT 5.5V 14TSSOP. Review the specifications below when checking this part for your BOM.
The SN74LVC07APWRE4 is a hex buffer and driver with open-drain outputs manufactured by Texas Instruments. It operates from a supply voltage of 1.65 V to 5.5 V. The device features six non-inverting inputs and corresponding open-drain outputs, housed in a 14-pin TSSOP package. Key electrical parameters include a maximum propagation delay of 2.6 ns at 5 V, a low-level output current capability of 24 mA, and a static current of 10 µA. It supports an operating temperature range from -40°C to +125°C.
Verify the specific ordering suffix 'E4' corresponds to lead-free and RoHS-compliant specifications as defined in the manufacturer's documentation. Confirm that the TSSOP-14 package variant matches the required board layout constraints. Ensure the component status is listed as active production data before finalizing procurement plans.
Select this component when a high-drive open-drain buffer is required for voltage translation between different logic levels. The wide input tolerance allows interfacing with 1.8-V, 2.5-V, 3.3-V, and 5-V devices. Consider the 24 mA sink current capability for driving multiple loads or LEDs. Verify thermal requirements for the TSSOP package in the intended application environment.
This part belongs to the SN74LVC07A family of hex buffers and drivers with open-drain outputs. The 'PW' suffix indicates the TSSOP-14 package type, while 'RE4' typically denotes tape and reel packaging with lead-free/RoHS compliance. This family is designed for 1.65-V to 5.5-V VCC operation and provides balanced output drive capabilities.
SN74LVC07ADGVR
Yes, the inputs and outputs accept voltages up to 5.5 V, allowing the device to translate signals up to 5.5 V or down to VCC.
The Ioff circuitry disables the outputs when VCC is 0 V, preventing damaging current backflow through the device during partial-power-down applications.
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