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SN74LVC112APWT is listed in the Flip Flops range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC FF JK TYPE DUAL 1BIT 16TSSOP. Review the specifications below when checking this part for your BOM.
The SN74LVC112APWT is a dual negative-edge-triggered J-K flip-flop manufactured by Texas Instruments, featuring integrated clear and preset functions. It operates within a supply voltage range of 1.65 V to 3.6 V and supports clock frequencies up to 150 MHz. The device exhibits a propagation delay of 7.1 ns and a turn-on delay time of 1 ns. It provides an output current capability of 24 mA and is housed in a 16-pin TSSOP package with tape-and-reel packaging.
Verify the specific ordering suffix 'PWT' corresponds to the 16-TSSOP package and tape-and-reel configuration as documented in the official datasheet. Confirm that the component meets the required RoHS compliance standards for your assembly process. Ensure that unused inputs are properly terminated to VCC or GND to maintain operational integrity during deployment.
Select this component when dual J-K flip-flops with active-low clear and preset controls are required in space-constrained designs. The LVC family offers compatibility with 3.3 V and 2.5 V logic levels while maintaining robust noise immunity. Consider the 16-TSSOP package dimensions for PCB layout constraints and verify thermal dissipation requirements for high-frequency operation scenarios.
This part belongs to the SN74LVC1xxA series of advanced CMOS logic devices from Texas Instruments. The LVC family is designed for low-voltage applications, providing performance comparable to standard TTL logic while operating at significantly lower power levels. The device integrates two independent flip-flops into a single compact package, optimizing board space for complex digital logic implementations.
Public confirmed substitute part numbers include SN74LVC112APW (tray version) and SN74LVC112PW (non-tape version). Verify pinout compatibility and electrical specifications before substitution. Ensure the replacement variant matches the required packaging format for automated assembly processes.
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