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The SN74LVC138AGQNR is a 3-line to 8-line decoder and demultiplexer manufactured by Texas Instruments. It operates within a supply voltage range of 2.0 V to 3.6 V, utilizing LVC logic technology. The device features three address inputs and eight active-low outputs, housed in a 20-pin Microstar Junior (4x3) BGA package. Key electrical parameters include a propagation delay of 6.7 ns and an output drive capability of 24 mA for both high and low states. It supports a wide operating temperature range from -40°C to +125°C.
Verify the specific package variant, as the AG suffix denotes the Microstar Junior BGA form factor. Confirm that the design accommodates the thermal requirements associated with this surface-mount package type. Ensure compatibility with the 2.0 V to 3.6 V supply voltage range during system integration. Check for any specific handling precautions related to the fine-pitch BGA construction during assembly processes.
Select this component when a compact 3-to-8 decoding solution is required in a small footprint. The Microstar Junior package offers space efficiency compared to larger TSSOP or SOIC alternatives. Consider the 24 mA output drive if direct driving of LEDs or relays is necessary without additional buffering. Verify that the 2.0 V minimum supply voltage aligns with the system's power rails.
This part belongs to the SN74LVC138A family of decoders and demultiplexers. The 'AQ' or 'AG' suffixes typically indicate automotive qualification or specific packaging variants within the broader LVC series. These devices are engineered for low-voltage CMOS operations, offering performance comparable to higher voltage standards while maintaining compatibility with modern low-power digital ecosystems.
Direct pin-compatible replacements may include other SN74LVC138 variants in different packages, such as SN74LVC138APWR (TSSOP-16). However, the Microstar Junior BGA package is unique; substitute parts must match the 20-ball BGA footprint and electrical specifications exactly. Verify lead times and availability for alternative packages if redesign is permitted.