SN74LVC157AD

Overview

The SN74LVC157AD is a quadruple 2-line to 1-line data selector/multiplexer manufactured by Texas Instruments. It operates from a supply voltage of 1.65V to 3.6V and features inputs that accept voltages up to 5.5V, enabling translation in mixed 3.3V/5V systems. The device provides a maximum propagation delay of 5.2ns at 3.3V and includes an active-low output strobe (G). It is housed in a 16-pin SOIC package and supports operating temperatures from -40°C to 125°C.

Feature Summary

• Operates within a wide supply voltage range of 1.65V to 3.6V
• Inputs tolerate 5.5V signals for compatibility with 5V logic devices
• Includes an active-low output strobe control input
• Provides high electrostatic discharge protection performance

Applications

• Mixed 3.3V/5V system environments requiring signal translation
• Data routing applications utilizing quadruple multiplexing
• Digital logic circuits requiring low-voltage operation

Procurement Notes

Verify the specific ordering suffix 'D' corresponds to the 16-pin SOIC package configuration. Confirm the temperature grade matches the required operational range of -40°C to 125°C. Ensure compliance with RoHS standards if applicable to the project requirements. Check for any specific moisture sensitivity level ratings relevant to the assembly process.

Selection Notes

Select this component when a quadruple 2-to-1 multiplexer is needed with 5.5V tolerant inputs. It is suitable for designs requiring operation down to 1.65V or interfacing between different voltage domains. Consider the SOIC package size and thermal characteristics for PCB layout constraints.

Part Context

This part belongs to the SNx4LVC157A series of quadruple 2-line to 1-line data selectors. The 'SN74' prefix indicates commercial grade availability, while the 'LVC' denotes Low-Voltage CMOS technology optimized for low power consumption and high speed.

Replacement Considerations

Compatible variants include SN74LVC157ADR and SN74LVC157APWR, which share identical logical functions but differ in packaging formats such as tape-and-reel SOIC or TSSOP.