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SN74LVC1G57YEPR is listed in the Gates And Inverters - Multi-Function, Configurable range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC CONFIG MULTI FUNCTION 6DSBGA. Review the specifications below when checking this part for your BOM.
The SN74LVC1G57YEPR is a single configurable multiple-function gate from Texas Instruments, utilizing advanced CMOS technology within the LVC series. It operates across a wide supply voltage range of 1.65V to 5.5V and supports seven logic functions: AND, OR, NAND, NOR, XNOR, inverter, and buffer. The device features Schmitt-trigger inputs for noise immunity and Ioff circuitry for partial power-down protection. Packaged in an 8-DSBGA (1.9x0.9mm) format, it ensures low static power consumption and robust performance across industrial temperature ranges.
Verify the specific package suffix 'YEPR' corresponds to the 8-DSBGA configuration during procurement. Confirm RoHS compliance status and lead times directly with authorized distributors or Texas Instruments representatives. Ensure design-in documentation matches the exact revision level required for your application to avoid compatibility issues.
Select this component when space-constrained designs require a single chip to replace multiple discrete logic gates. It is suitable for applications needing flexible logic implementation without increasing PCB footprint. Consider the DSBGA package for high-density layouts where standard SOIC or SC-70 packages are too large.
This part belongs to the Texas Instruments SN74LVC1Gxx family of single-gate configurable logic devices. These components are designed to reduce bill-of-materials complexity by offering multiple logic options in one package. The LVC series is characterized by low voltage operation and high speed, making it ideal for modern low-power digital systems.
The device supports AND, OR, NAND, NOR, XNOR, inverter, and buffer functions via pin configuration.
Yes, the integrated Ioff circuit prevents backflow current, allowing safe partial power-down and hot insertion operations.
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