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SN74LVC541ADB is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUFF/DVR TRI-ST 8BIT 20SSOP. Review the specifications below when checking this part for your BOM.
The SN74LVC541ADB is an octal buffer and driver manufactured by Texas Instruments, featuring three-state outputs. It operates within a supply voltage range of 1.65V to 3.6V. The device provides eight input lines and eight output lines, supporting non-inverting logic functions. It utilizes a 20-pin SSOP surface-mount package. Key electrical characteristics include high-level and low-level output currents of 24mA each. The component supports mixed 3.3V/5V system environments, allowing inputs to be driven by 3.3V or 5V devices while maintaining compatibility with the lower supply voltage operation.
Verify the specific suffix 'ADB' corresponds to the SSOP-20 package configuration when sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure design reviews account for the specified operating temperature range and static current parameters to maintain system reliability under varying thermal conditions.
Select this component for applications requiring octal buffering with three-state output control in low-voltage logic families. It is suitable for designs needing interface flexibility between 3.3V and 5V logic levels. Consider the SSOP-20 package constraints regarding board space and thermal dissipation requirements during the layout phase.
This part belongs to the SN74LVC541A family of octal buffers and drivers. It shares functional similarities with other members like the SN74LVC541APWR but differs in packaging. The ADB suffix specifically denotes the SSOP-20 form factor, distinguishing it from TSSOP or SOIC variants within the same logical series.
The SN74LVC541APWR serves as a pin-compatible alternative within the same family, offering identical logical functionality in a TSSOP-20 package. Verify mechanical fit and thermal performance differences when substituting between SSOP and TSSOP footprints.
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