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SN74LVTH240DB is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC INVERTER DUAL 4-INPUT 20SSOP. Review the specifications below when checking this part for your BOM.
The SN74LVTH240DB is an octal buffer and line driver from the Texas Instruments LVTH logic family, housed in a 20-pin SSOP package. It operates within a supply voltage range of 2.7 V to 3.6 V. The device features eight inputs and outputs with three-state capability and inverting polarity. Key electrical specifications include a high-level output current of -32 mA and a low-level output current of 64 mA. Propagation delay is specified at 2.6 ns at 3.3 V. The component supports surface-mount installation and functions across an operating temperature range of -40°C to +85°C.
Verify the specific package variant, as SN74LVTH240DB typically denotes the SSOP-20 configuration. Confirm RoHS compliance status and lead times directly with authorized distributors or Texas Instruments. Ensure the ordering suffix matches the required tape-and-reel or tube packaging format for your assembly process.
Select this component when designing systems requiring 3.3-V logic levels with high drive strength and fast switching speeds. The LVTH series offers improved performance over standard LVT devices. Ensure the application environment stays within the specified -40°C to +85°C temperature range and that the 2.7 V to 3.6 V supply voltage constraints are met.
This part belongs to the SN74LVTH240 series of octal buffers and line drivers. It is part of Texas Instruments' broader portfolio of 3.3-V ABT logic products. The device serves as a critical interface component in digital systems, facilitating signal integrity and level shifting between different logic domains in high-speed applications.
Direct pin-compatible alternatives within the same family include SN74LVTH240PWR (TSSOP) or SN74LVTH240NSR (SOIC). Verify that substitute parts maintain identical electrical characteristics, package dimensions, and thermal requirements before implementation.
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