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SN74LVTH543PWR is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC TXRX NON-INVERT 3.6V 24TSSOP. Review the specifications below when checking this part for your BOM.
The SN74LVTH543PWR is an octal bus transceiver manufactured by Texas Instruments, belonging to the 74LVTH logic series. It operates within a supply voltage range of 2.7V to 3.6V and features non-inverting data paths with tri-state outputs. The device integrates latches on both the A (input) and B (output) sides, allowing for independent direction control via separate OE (Output Enable) pins. Packaged in a 24-TSSOP surface-mount housing, it supports bidirectional data transfer between external buses and internal circuitry.
Verify component authenticity through authorized distribution channels due to market availability fluctuations. Confirm package marking details match the 24-TSSOP specification. Check RoHS compliance status as manufacturing processes may evolve. Ensure storage conditions adhere to moisture sensitivity level requirements prior to reflow soldering.
Select this component when simultaneous latching at both ends of a bidirectional bus is required. Compare against standard non-latched variants like the SN74LVT543 if data holding is unnecessary. Evaluate power consumption characteristics relative to system thermal constraints. Verify voltage compatibility with connected logic families operating within the 2.7V to 3.6V window.
This part belongs to the Texas Instruments 74LVTH family, which combines Low-Voltage TTL compatibility with BiCMOS technology for high-speed performance. The '543' designation specifically indicates an octal bus transceiver with latches. It differs from the SN74LVT543 by adding internal storage elements, making it suitable for interfaces where data stability during bus transitions is critical.
The SN74LVTH543PW serves as a tube-packaged alternative offering identical electrical functionality. Designers must verify pinout compatibility and ensure the change in packaging does not impact PCB layout or thermal management strategies.
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