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SN74LVTT244DW is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is BUS DRIVER, LVT SERIES, 4-BIT. Review the specifications below when checking this part for your BOM.
The SN74LVTT244DW is an octal buffer and line driver from the Texas Instruments LVTT series, designed for 3.3-V ABT applications. It features non-inverting logic with three-state outputs and operates within a supply voltage range of 2.7 V to 3.6 V. The device provides high drive capability with output currents of -32 mA at high level and 64 mA at low level. It utilizes a 20-pin SOIC package and supports surface-mount installation. The component exhibits a propagation delay of 2.3 ns at 3.3 V and maintains a static current of 5 mA.
Verify the specific suffix 'DW' corresponds to the 20-pin SOIC package and tube packaging configuration. Confirm RoHS compliance status through the official datasheet or manufacturer documentation prior to procurement. Ensure the ordering part number matches the required temperature grade and electrical specifications exactly.
Select this component when designing 3.3-V logic interfaces requiring octal buffering with three-state capabilities. It is suitable for applications needing moderate speed with 2.3 ns propagation delay. Consider alternative packages if space constraints require TSSOP or smaller form factors, as this model is fixed to the SOIC-20 footprint.
This part belongs to the SN74LVTT244A family of octal buffers and line drivers. It is part of Texas Instruments' broader portfolio of logic ICs focused on 3.3-V ABT technology. The family includes variants with different packaging options such as PW (TSSOP) and PWR (TSSOP Reel), offering flexibility for various assembly requirements while maintaining consistent electrical performance.
Direct replacements include SN74LVTT244PW and SN74LVTT244PWR, which share identical electrical characteristics but differ in package type (TSSOP) or reel packaging. Verify pinout compatibility and thermal performance when substituting between SOIC and TSSOP packages.
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