SN75LVDT1422PAG

SN75LVDT1422PAG

$6.61
  • Description:IC SERDES 175MBPS 64TQFP
  • Series:-

SKU:ae6fc56a96ec Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SERDES 175MBPS 64TQFP
  • Series:-
  • Mfr:Texas Instruments
  • Package:Tray
  • Function:Serializer/Deserializer
  • Data Rate:175Mbps
  • Input Type:LVDS, LVTTL
  • Output Type:LVDS
  • Number of Inputs:2月14日
  • Number of Outputs:2月14日
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-10°C ~ 70°C (TA)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:64-TQFP
  • Supplier Device Package:64-TQFP (10x10)

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SN75LVDT1422PAG

Overview

The SN75LVDT1422PAG is a dual-channel LVDS line driver manufactured by Texas Instruments, designed for high-speed serial data transmission. It operates within a supply voltage range of 3.0 V to 3.6 V and supports data rates up to 650 Mbps per channel. The device features differential outputs with a typical output voltage swing of 350 mV and includes an enable pin for power management. Packaged in a 20-pin TSSOP (PAG) housing, it complies with the ANSI/TIA/EIA-644 LVDS standard, ensuring low electromagnetic interference and reliable signal integrity in demanding electronic environments.

Feature Summary

  • Dual-channel architecture supporting independent or parallel data transmission
  • Compliance with ANSI/TIA/EIA-644 LVDS electrical standards
  • Low-power operation with dedicated enable control functionality

Applications

  • High-speed serial communication interfaces
  • Data acquisition systems requiring differential signaling
  • Test and measurement equipment

Procurement Notes

Verify the specific package variant and temperature grade against project requirements. Confirm that the 20-pin TSSOP footprint matches the PCB layout specifications. Ensure compatibility with the system's 3.3 V logic levels and check for any RoHS compliance documentation required for regulatory adherence.

Selection Notes

Select this component when dual-channel LVDS transmission is required at speeds up to 650 Mbps. Consider the TSSOP package constraints regarding thermal dissipation and board space. Evaluate the need for the enable feature versus always-on operation based on system power budget and signal routing complexity.

Part Context

This part belongs to Texas Instruments' LVDS interface family, which provides standardized solutions for high-speed digital interconnects. It complements other components like receivers and equalizers in complete link architectures. The PAG suffix specifically denotes the plastic thin-shrink small-outline package with lead-free finish, distinguishing it from ceramic or alternative plastic variants.

Replacement Considerations

Direct replacements may include the SN75LVDT1422DR (SOIC package) for pin-compatible board updates. Verify electrical parameters and package dimensions before substitution. Cross-reference with SN75LVDT1422PW for alternative TSSOP sourcing options.

SN75LVDT1422PAGSN75LVDT1422PAG
$6.61
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