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SNJ54HC112J is listed in the Flip Flops range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is DUAL J-K NEGATIVE-EDGE-TRIGGERED. Review the specifications below when checking this part for your BOM.
The SNJ54HC112J is a military-grade dual J-K negative-edge-triggered flip-flop manufactured by Texas Instruments. It features independent clear and preset inputs for direct control of output states. The device operates within a supply voltage range of 2V to 6V and supports data rates up to 24 MHz. It is housed in a 16-pin ceramic dual in-line package (CDIP) designed for high reliability. The component functions across an extended temperature range from -55°C to 125°C, ensuring stable performance in demanding environments.
Verify the authenticity of the SNJ54HC112J through authorized TI channels or certified distributors. Confirm that the part meets MIL-PRF-38534 or equivalent military specifications. Check for proper ceramic sealing and lead integrity. Ensure storage conditions comply with moisture sensitivity levels for ceramic packages. Request full traceability documentation including lot codes and test reports.
Select the SNJ54HC112J when military-grade reliability and wide temperature operation are required. Compare against SN74HC112N for commercial applications where lower cost suffices. Consider SN54HC112W for alternative packaging options if available. Evaluate power consumption requirements against HC series standards. Ensure interface compatibility with existing system logic levels.
The SNJ54HC112J belongs to the SNx4HC family of high-speed CMOS logic devices. This family provides compatibility with TTL inputs while offering low power consumption. The SNJ prefix indicates a military-grade version with specific screening and testing requirements. It complements other HC-series components like buffers and gates in complex digital designs.
SN74HC112N serves as a commercial equivalent but lacks military qualification. SN54HC112W offers a wire-leaded variant for different mounting needs. Verify pinout compatibility before substitution. Assess thermal management requirements for alternative packages.
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