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The SNJ54LVTH16373WD is a military-grade, 16-bit transparent D-type latch with 3-state outputs from the Texas Instruments Widebus family. It utilizes Advanced BiCMOS (ABT) technology for 3.3-V operation and supports mixed-mode signal environments with 5-V input/output compatibility. The device features active bus-hold circuitry to eliminate external pullup/pulldown resistors and includes Ioff and power-up 3-state capabilities for hot insertion applications. It operates within a temperature range of -55°C to +125°C and is housed in a 48-lead Ceramic Dual Flatpack (CFP-WD) package.
Verify that the specific part number SNJ54LVTH16373WD corresponds to the QML-certified military version rather than standard catalog variants like SN74LVTH16373. Confirm the CFP-WD ceramic package requirement matches the design specifications. Ensure procurement channels are authorized for defense-grade components, as availability may differ from commercial inventory streams.
Select this component when system requirements demand radiation-hardened reliability and extended temperature ranges beyond standard industrial limits. The ABT technology provides low static-power dissipation suitable for battery-operated or power-sensitive designs. Verify that the 3.3-V supply voltage aligns with the core logic levels while ensuring the 5-V tolerant inputs match the source interface signals.
This device belongs to the SN54LVTH16373 series, representing the military-grade subset of the broader LVTH16373 family. While commercial versions utilize plastic packages like TSSOP or SSOP, the WD suffix denotes the hermetically sealed ceramic dual flatpack construction required for MIL-PRF-38535 compliance. It shares functional architecture with SN74LVTH16373 but differs in qualification standards and packaging materials.
Public confirmed substitute part numbers include SNJ54LVTH16373WD itself as the primary reference. For non-military applications, SN74LVTH16373 variants such as DGGR or DL offer identical logical functionality in plastic packages. Direct replacement requires verifying package footprint compatibility between CFP-WD and alternative surface-mount options.