SNSR20F30WC1NXT5G

Overview

The SNSR20F30WC1NXT5G is a Schottky barrier diode manufactured by onsemi, belonging to the NSR20F30NX series. It features a 30 V maximum repetitive reverse voltage and a 2 A average forward rectified current rating. The device utilizes a 0603 FC (Flip Chip) package configuration, providing a compact surface-mount solution for high-frequency applications. Key electrical characteristics include a low forward voltage drop of approximately 480 mV at 2 A and a maximum junction operating temperature of 150°C. This component is designed for efficient switching and rectification in space-constrained electronic circuits.

Feature Summary

• Low forward voltage drop for improved efficiency
• Compact 0603 FC flip chip package design
• High-speed switching capability suitable for high-frequency applications

Applications

• High-frequency switching circuits
• Space-constrained power management modules
• Efficient rectification in compact electronic devices

Procurement Notes

Verify the specific suffix 'WC1' against official onsemi documentation to confirm exact pinout and thermal specifications, as variations within the NSR20F30NX family may exist. Ensure compatibility with automated assembly processes due to the flip chip package type. Cross-reference the part number with manufacturer databases to confirm current production status and availability constraints prior to procurement.

Selection Notes

Select this component when a small footprint and high efficiency are required for low-voltage, medium-current applications. The 0603 FC package offers superior thermal performance compared to standard leaded packages. Consider the 30 V reverse voltage limit and 2 A current rating to ensure adequate headroom for the target circuit design. Evaluate the low forward voltage characteristic for minimizing power loss in sensitive power paths.

Part Context

This part belongs to the NSR20F30NX series of Schottky barrier diodes from onsemi. The series is characterized by its use of flip chip technology to achieve minimal profile and enhanced thermal dissipation. These diodes are engineered for modern consumer electronics and industrial applications where size reduction and energy efficiency are critical design parameters.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.